EECS Seminar: The Future of Heterogeneous Integration & Moore's Law

Abstract:  Moore’s law has helped us for 5+ decades through monolithic integration with packaging taking a back seat. We have now reached a stage in the semiconductor industry where advanced packaging is beginning to take the front seat, with billions of dollars being invested in it. Does this mean the end of Moore’s law? So, what has changed for packaging to take center stage? Is Heterogeneous Integration (HI) the same as what was practiced in the past? Why is AI a key driver for HI and how can HI help AI? Can HI be used to continue Moore's law?

Bio: Madhavan Swaminathan is the department head of electrical engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the director for the Center for Heterogeneous Integration of Micro Electronic Systems, an SRC JUMP 2.0 Center www.chimes.psu.edu.

Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), professor in ECE with a joint appointment in the School of Materials Science and Engineering, and director of the 3D Systems Packaging Research Center – a graduated NSF-Engineering Research Center, Georgia Tech. Prior to that, he was with IBM working on packaging for supercomputers.

Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), three books, five book chapters, 31 patents, 34 best paper and student paper awards, five GT awards, two start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (highest technical field award in packaging) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society. He is a fellow of IEEE, the National Academy of Inventors and the Asia-Pacific Artificial Intelligence Association, and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility Society. He serves as an advisor for India Semiconductor Mission, is a member of the External Advisory Board for Move2THz (an EU initiative), and is on the advisory board for 3DGS and Claros.

He received his master's and doctoral degrees in electrical engineering from Syracuse University.